TE Connectivity Passive Product
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HSC100330RJ
Helaian data

HSC100330RJ

RES CHAS MNT 330 OHM 5% 100W
Nombor Bahagian
HSC100330RJ
Pengeluar/Jenama
TE Connectivity Passive Product
Siri
HS, CGS
Status Bahagian
Active
Pembungkusan
Bulk
Suhu Operasi
-55°C ~ 200°C
Saiz / Dimensi
2.579" L x 1.870" W (65.50mm x 47.50mm)
Ketinggian - Duduk (Maks)
1.024" (26.00mm)
Toleransi
±5%
Pekali Suhu
±30ppm/°C
ciri-ciri
-
Kadar kegagalan
-
Pakej / Kes
Axial, Box
Gaya Utama
Solder Lugs
Ciri Pemasangan
Flanges
Kuasa (Watts)
100W
Rintangan
330 Ohms
Komposisi
Wirewound
Salutan, Jenis Perumahan
Aluminum
Minta Sebut Harga
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Maklumat perhubungan
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Kata kunci daripada HSC100330RJ
HSC100330RJ Komponen elektronik
HSC100330RJ Jualan
HSC100330RJ Pembekal
HSC100330RJ Pengedar
HSC100330RJ Jadual data
HSC100330RJ Foto
HSC100330RJ harga
HSC100330RJ Tawaran
HSC100330RJ Harga terendah
HSC100330RJ Cari
HSC100330RJ Membeli
HSC100330RJ Chip