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BZV55B9V1 L1G

BZV55B9V1 L1G Encyclopedia Entry

Product Overview

The BZV55B9V1 L1G belongs to the category of Zener diodes, which are widely used in electronic circuits for voltage regulation and protection. These diodes exhibit specific characteristics that make them suitable for various applications. The package type for the BZV55B9V1 L1G is SOD-80C, and it is available in quantities specified by the manufacturer.

Specifications

  • Voltage: 9.1V
  • Power Dissipation: 500mW
  • Zener Voltage Tolerance: ±5%
  • Operating Temperature Range: -65°C to +150°C
  • Storage Temperature Range: -65°C to +175°C

Detailed Pin Configuration

The BZV55B9V1 L1G has two pins, with the cathode connected to the semiconductor's p-type material and the anode connected to the n-type material.

Functional Features

  • Voltage Regulation: The BZV55B9V1 L1G provides a stable output voltage, making it suitable for voltage regulation in electronic circuits.
  • Overvoltage Protection: It prevents damage to sensitive components by diverting excess voltage away from the circuit.

Advantages and Disadvantages

Advantages

  • Precise voltage regulation
  • Compact size
  • Wide operating temperature range

Disadvantages

  • Limited power dissipation capability
  • Sensitivity to temperature variations

Working Principles

The BZV55B9V1 L1G operates based on the principle of the Zener effect, where it maintains a constant voltage across its terminals when reverse-biased at the specified voltage.

Detailed Application Field Plans

The BZV55B9V1 L1G is commonly used in: - Voltage regulators - Overvoltage protection circuits - Signal clamping circuits

Detailed and Complete Alternative Models

  • BZX84C9V1: SOT-23 package, 250mW power dissipation
  • 1N4739A: DO-41 package, 1W power dissipation

In conclusion, the BZV55B9V1 L1G Zener diode offers precise voltage regulation and overvoltage protection, making it a valuable component in various electronic applications.

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Senaraikan 10 soalan dan jawapan biasa yang berkaitan dengan aplikasi BZV55B9V1 L1G dalam penyelesaian teknikal

  1. What is the BZV55B9V1 L1G diode used for?

    • The BZV55B9V1 L1G diode is commonly used for voltage regulation and protection in various technical solutions.
  2. What is the maximum forward voltage of the BZV55B9V1 L1G diode?

    • The maximum forward voltage of the BZV55B9V1 L1G diode is typically around 0.9V at a forward current of 5mA.
  3. What is the reverse breakdown voltage of the BZV55B9V1 L1G diode?

    • The reverse breakdown voltage of the BZV55B9V1 L1G diode is 9.1V, making it suitable for low voltage applications.
  4. Can the BZV55B9V1 L1G diode be used for overvoltage protection?

    • Yes, the BZV55B9V1 L1G diode can be used for overvoltage protection due to its reverse breakdown characteristics.
  5. What are the typical applications of the BZV55B9V1 L1G diode?

    • Typical applications of the BZV55B9V1 L1G diode include voltage clamping, overvoltage protection, and general purpose voltage regulation.
  6. What is the power dissipation of the BZV55B9V1 L1G diode?

    • The power dissipation of the BZV55B9V1 L1G diode is typically around 500mW, allowing it to handle moderate power levels.
  7. Is the BZV55B9V1 L1G diode suitable for low current applications?

    • Yes, the BZV55B9V1 L1G diode is suitable for low current applications due to its low leakage current and voltage drop.
  8. What is the temperature range for the BZV55B9V1 L1G diode?

    • The BZV55B9V1 L1G diode is typically rated for a temperature range of -65°C to +150°C, making it suitable for a wide range of operating conditions.
  9. Can the BZV55B9V1 L1G diode be used in automotive applications?

    • Yes, the BZV55B9V1 L1G diode can be used in automotive applications where low voltage regulation and overvoltage protection are required.
  10. Are there any specific soldering or mounting considerations for the BZV55B9V1 L1G diode?

    • It is recommended to follow standard industry practices for soldering and mounting the BZV55B9V1 L1G diode, including proper heat sinking and avoiding excessive mechanical stress during assembly.