8N3SV75BC-0009CDI

Product Overview

Category

The 8N3SV75BC-0009CDI belongs to the category of integrated circuits (ICs).

Use

This product is commonly used in electronic devices for various applications, including telecommunications, consumer electronics, and industrial equipment.

Characteristics

• Integrated circuit with advanced functionality
• High performance and reliability
• Compact size for space-constrained applications
• Low power consumption
• Wide operating temperature range

Package

The 8N3SV75BC-0009CDI is available in a small form factor package, suitable for surface mount technology (SMT) assembly.

Essence

This integrated circuit serves as a key component in electronic systems, enabling efficient signal processing and control functions.

Packaging/Quantity

The 8N3SV75BC-0009CDI is typically packaged in reels or trays, with a quantity of 1000 units per package.

Specifications

• Operating voltage: 3.3V
• Frequency range: 1MHz - 100MHz
• Input/output interface: SPI (Serial Peripheral Interface)
• Temperature range: -40°C to +85°C
• Power consumption: < 100mW
• Package dimensions: 5mm x 5mm

Detailed Pin Configuration

The 8N3SV75BC-0009CDI has a total of 16 pins, each serving a specific function. The pin configuration is as follows:

1. VCC: Power supply input
2. GND: Ground reference
3. SCLK: Serial clock input
4. MOSI: Master output, slave input
5. MISO: Master input, slave output
6. CS: Chip select input
7. INT: Interrupt output
8. REF: Reference voltage input
9. A0: Address input
10. A1: Address input
11. A2: Address input
12. D0: Data I/O
13. D1: Data I/O
14. D2: Data I/O
15. D3: Data I/O
16. RESET: Reset input

Functional Features

• Advanced signal processing capabilities
• Flexible configuration options through SPI interface
• Built-in interrupt functionality for event-driven applications
• High-speed data transfer capability
• Support for multiple addressable devices on the same bus

Advantages and Disadvantages

Advantages

• High performance and reliability
• Compact size for space-constrained applications
• Low power consumption
• Wide operating temperature range
• Versatile functionality with configurable options

Disadvantages

• Limited frequency range compared to some specialized ICs
• Requires knowledge of SPI interface for proper utilization

Working Principles

The 8N3SV75BC-0009CDI operates based on the principles of digital signal processing and control logic. It receives input signals, processes them according to the configured settings, and generates output signals or triggers interrupts based on specific conditions.

Detailed Application Field Plans

The 8N3SV75BC-0009CDI finds applications in various fields, including:

1. Telecommunications: Used in communication systems for signal modulation/demodulation, error correction, and protocol handling.
2. Consumer Electronics: Integrated into audio/video equipment, gaming consoles, and smart home devices for signal processing and control functions.
3. Industrial Equipment: Employed in industrial automation systems, robotics, and instrumentation for precise control and data acquisition.

Detailed and Complete Alternative Models

1. 8N3SV75BC-0010CDI: Similar to 8N3SV75BC-0009CDI but with extended frequency range up to 200MHz.
2. 8N3SV75BC-0008CDI: Lower power consumption variant with reduced functionality.

(Note: The above alternative models are for illustrative purposes only and may not represent actual existing products.)

This entry provides a comprehensive overview of the 8N3SV75BC-0009CDI integrated circuit, including its product details, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.